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september 2010 doc id 15508 rev 2 1/12 12 EMIF04-EAR02M8 4-line ipad? emi filter a nd esd protecti on for headset features lead-free package high attenuation: -30 db at 900 mhz low cut-off frequencies: 60 mhz for speaker lines high current capability: 50 ma per line very low pcb space consumption: 1.5 mm x 1.7 mm very thin package: 0.6 mm maximum high efficiency in esd suppression iec6 1000-4-2 level 4 high reliability offered by monolithic integration complies with following standards: iec 61000-4-2 level 4 all pins: ? 15 kv (air discharge) ? 8 kv (contact discharge) application mobile phones description the EMIF04-EAR02M8 chip is a highly integrated device designed to suppress emi/rfi noise for mobile phone headsets. the new lc architecture on the speaker lines provides a high attenuation value maintaining a very low serial resistance. the qfn-8l package offe rs the possibility to integrate the whole function in a very small pcb space. additionally, this filter includes esd protection circuitry, which prevents damage to the protected device when subjected to esd surges up 30 kv. figure 1. pin configuration (bottom side) figure 2. equivalent circuit tm: ipad is a trademar k of stmicroelectronics qfn-8l gnd mic_p_int mic_p_ext mic_n_int mic_n_ext ear_int ear_ext ear_int ear_ext c l_mic r mic c l_ear l ear c l_mic r mic c l_ear l ear c l_mic r mic c l_mic r mic c l_ear l ear c l_ear l ear c l_mic r mic c l_mic r mic c l_ear l ear c l_ear l ear www.st.com
characteristics EMIF04-EAR02M8 2/12 doc id 15508 rev 2 1 characteristics figure 3. electrical symbols and parameters table 1. absolute maximum ratings (t amb = 25 c) symbol parameter value unit v pp esd iec 61000-4-2 air discharge contact discharge 30 30 kv i ear maximum rms current per channel 50 ma t j operating junction temperature -30 to 125 c t stg storage temperature range -55 to +150 c table 2. electrical characteristics (t amb = 25 c) symbol test conditions min. typ. max. unit v br i r = 1 ma 7 v i rm v rm = 3 v 100 na l ear 1.5 nh r l parasitic resistance of inductor l ear 0.30 0.6 r mic 54 68 82 c l_ear v r = 0 v dc, 1 mhz 84 105 126 pf c l_mic v r = 0 v dc, 1 mhz 60 76 92 pf f c_ear cut-off frequency earphone line: z source = z load = 50 60 mhz f c_mic cut-off frequency microphone line: z source = z load = 50 70 mhz v i v br v br v br v rm i rm i rm v rm i rm v rm breakdown voltage stand-off voltage leakage current @ v rm
EMIF04-EAR02M8 characteristics doc id 15508 rev 2 3/12 figure 4. s21 attenuation measurement figure 5. analog cross talk measurements 100k 1m 10m 100m 1g -50 -45 -40 -35 -30 -25 -20 -15 -10 -5 0 mic_n mic_p ear_r ear_l db f (hz) 100k 1m 10m 100m 1g -70 -60 -50 -40 -30 -20 -10 0 mic_n - mic_p ear_l - mic_p db f (hz) figure 6. esd response to iec 61000-4-2 (+15 kv air discharge) on one mic input (v in ) and on one mic output figure 7. esd response to iec 61000-4-2 (-15 kv air discharge) on one mic input (v in ) and on one mic output 5.00 v/div 5.00 v/div 100 ns/div in out 5.00 v/div 5.00 v/div 100 ns/div in out figure 8. esd response to iec 61000-4-2 (+15 kv air discharge) on one ear input (v in ) and on one ear output figure 9. esd response to iec 61000-4-2 (-15 kv air discharge) on one ear input (v in ) and on one ear output 5.00 v/div 5.00 v/div 100 ns/div in out 5.00 v/div 5.00 v/div 100 ns/div in out
characteristics EMIF04-EAR02M8 4/12 doc id 15508 rev 2 figure 14. total harmonic distortion with noise: ear lines, r = 8 figure 10. relative line capacitance variation versus applied voltage figure 11. total harmonic distortion with noise: mic lines, r = 10 k 1.0 0.8 0.6 c/c0 v (v) r 0 1 2 3 5 4 ear lines mic lines thd + n (db) f (hz) 0 -50 -100 100 1 k 10 k figure 12. total harmonic distortion with noise: mic lines, r = 32 figure 13. total harmonic distortion with noise: ear lines, r = 32 thd + n (db) f (hz) 0 100 1 k 10 k -50 -100 thd + n (db) f (hz) 0 100 1 k 10 k -50 -100 thd + n (db) f (hz) 0 100 1 k 10 k -50 -100
EMIF04-EAR02M8 application information doc id 15508 rev 2 5/12 2 application information figure 15. example of application scheme using EMIF04-EAR02M8 3 ordering information scheme figure 16. ordering information scheme audio sub - system emif04 - ear02m8 headset connector cable mic_p mic_n ear_r ear_l v dd v dd audio sub - system emif04 - ear02m8 headset connector cable mic_p mic_p mic_n mic_n ear_r ear_r ear_l ear_l v dd v dd mic_p_ext mic_p_int mic_n_ext mic_n_int ear_ext ear_ext ear_int ear_int gnd emif yy - xxxzz m8 emi filter number of lines information package xxx = application zz = version m8 = qfn-8l
package information EMIF04-EAR02M8 6/12 doc id 15508 rev 2 4 package information epoxy meets ul94, v0 lead-free package in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. table 3. qfn-8l dimensions ref. dimensions millimeters inches min. typ. max. min. typ. max. a 0.50 0.55 0.60 0.020 0.022 0.024 a1 0.00 0.02 0.05 0.000 0.001 0.002 b 0.15 0.18 0.25 0.006 0.007 0.001 d 1.65 1.70 1.75 0.067 d2 1.15 1.3 1.4 0.045 0.051 0.055 e 1.45 1.50 1.55 0.059 e2 0.05 0.20 0.30 0.002 0.008 0.012 e 0.40 0.016 k 0.20 0.008 l 0.25 0.30 0.35 0.010 0.012 0.014 e e2 d d2 n 1 2 a a1 e b k l 1 n 2 figure 17. footprint figure 18. marking 0.40 0.20 0.60 0. 3 2 2.10 0.26 1. 3 2 xx dot: pin1 identification xx = marking
EMIF04-EAR02M8 package information doc id 15508 rev 2 7/12 figure 19. tape and reel specification note: product marking may be rotated by multiples of 90 for assembly plant differentiation. in no case should this product marking be used to orient the component for its placement on a pcb. only pin 1 mark is to be used for this purpose. user direction of unreeling all dimensions in mm 4.0 0.1 2.0 0.05 8.0 0.3 4.0 0.1 1.75 0.1 3.5 - 0.1 ? 1.55 0.05 0.70 0.05 1.75 0.1 0.25 0.05 1.95 0.1 ka ka ka
recommendation on pcb assembly EMIF04-EAR02M8 8/12 doc id 15508 rev 2 5 recommendation on pcb assembly 5.1 stencil opening design 1. general recommendation on stencil opening design a) stencil opening dimensions: l (length), w (width), t (thickness). figure 20. stencil opening dimensions b) general design rule stencil thickness (t) = 75 ~ 125 m 2. reference design a) stencil opening thickness: 100 m b) stencil opening for central exposed pad: opening to footprint ratio is 50%. c) stencil opening for leads: opening to footprint ratio is 90%. figure 21. recommended stencil window position l t w aspect ratio w t ----- 1.5 = aspect area lw 2t l w + () --------------------------- - 0.66 = 200 m 600 m 570 m 190 m 15 m 15 m 5 m 5 m 1 3 20 m 260 m 10 8 0 m 160 m 120 m 120 m 50 m 50 m footprint s tencil window footprint t=100 m
EMIF04-EAR02M8 recommendation on pcb assembly doc id 15508 rev 2 9/12 5.2 solder paste 1. halide-free flux qualification rol0 according to ansi/j-std-004. 2. ?no clean? solder paste is recommended. 3. offers a high tack force to resist component movement during high speed 4. solder paste with fine particles: powder particle size is 20-45 m. 5.3 placement 1. manual positioning is not recommended. 2. it is recommended to use the lead recognition capabilities of the placemen t system, not the outline centering 3. standard tolerance of 0.05 mm is recommended. 4. 3.5 n placement force is recommended. too much placement force can lead to squeezed out solder paste and cause solder joints to short. too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. 5. to improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool. 6. for assembly, a perfect supporting of the pcb (all the more on flexible pcb) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools. 5.4 pcb design preference 1. to control the solder paste amount, the closed via is recommended instead of open vias. 2. the position of tracks and open vias in the solder area should be well balanced. the symmetrical layout is recommended, in case any tilt phenomena caused by asymmetrical solder paste amount due to the solder flow away.
recommendation on pcb assembly EMIF04-EAR02M8 10/12 doc id 15508 rev 2 5.5 reflow profile figure 22. st ecopack? recommended soldering reflow profile for pcb mounting note: minimize air convection currents in the reflow oven to avoid component movement. 0 01234567 time (min) temperature (c) 2c/s recommended 6c/s max 220c 125 c 260c max 255c 180c 90 sec max 10-30 sec 90 to 150 sec 3c/s max 0 01234567 time (min) temperature (c) 2c/s recommended 6c/s max 220c 125 c 260c max 255c 180c 90 sec max 10-30 sec 90 to 150 sec 3c/s max
EMIF04-EAR02M8 ordering information doc id 15508 rev 2 11/12 6 ordering information for the latest information on available order codes see the product pages on www.st.com. 7 revision history table 4. ordering information order code marking package weight base qty delivery mode EMIF04-EAR02M8 ka (1) 1. the marking can be rotated by multiples of 90 to differentiate assembly location. qfn-8l 3.8 mg 3000 tape and reel table 5. document revision history date revision changes 24-mar-2009 1 initial release 02-sep-2010 2 changed ?input pins? to ?all pins? in standards compliance section. updated figure 16 . added paragraph in section 6: ordering information .
EMIF04-EAR02M8 12/12 doc id 15508 rev 2 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by an authorized st representative, st products are not recommended, authorized or warranted for use in milita ry, air craft, space, life saving, or life sustaining applications, nor in products or systems where failure or malfunction may result in personal injury, death, or severe property or environmental damage. st products which are not specified as "automotive grade" may only be used in automotive applications at user?s own risk. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2010 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com

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